Samsung Electronics’ foundry division announced that it will mass produce 1.4-nanometer chips in 2027, while Intel (INTC-US) also revealed that Intel 18A test chips (equivalent to 1.8-nanometer) will be trialled by the end of the period. This year. Compared to TSMC (2330-TW) (TSM-US), the advanced process technology blueprint has only been revealed to 2 nanometers. Samsung and Intel are very ambitious. The advanced process competition is aimed at less than 2 nanometers, and the sword is aimed at TSMC’s leading position.
Samsung has presented a more aggressive five-year plan this time, with the goal of doubling the foundry’s business revenue in 2027 compared to the level of 2021. To achieve this goal, advanced process technology must first be improved.
In the advanced process technology blueprint, Samsung plans to start mass production of the third-generation 3nm process in 2024, mass production of advanced 2nm chips in 2025, and mass production of 1.4nm in 2027. Despite the global economic headwinds currently, there are plans to more than triple production capacity for advanced wafers in five years to meet strong demand.
At the recent Intel Innovation Conference 2022, Intel revealed the new progress in the development of advanced processes. The Intel 18A test chip is being designed and will be piloted by the end of this year. CEO Kissinger also said that the progress of the advanced process was smooth and even exceeded expectations, and reiterated that he would launch five generations of advanced process within four years.
According to the current plan released by Intel, Intel 4 will be mass produced in the second half of this year, Intel 3 next year, Intel 20A (equivalent to 2 nm) in early 2024, and the Intel process 18A is mass produced. in the same year.
TSMC will mass produce 3nm in the second half of this year, the N3E process will be launched a year after mass production of 3nm, and 2nm will come out in 2025, and it is confident that this is the technology with the minimum density and best performance.
Although Samsung presciently announced at the end of June this year that it had become the world’s first semiconductor factory to mass produce a 3-nanometer process, the outside world has always been skeptical of its production rate, customers and orders. Industry insiders believe that one of the reasons why Samsung 3nm has failed to attract customers is that it adopts a new GAAFET architecture, the actual performance has not been verified by large-scale applications, and customers do not have enough confidence in its yield rate.
TSMC, on the other hand, has secured orders from major customers such as Apple, Intel, MediaTek (2454-TW) and NVIDIA (NVDA-US), although the mass production time is 2 months later than Samsung, the market still expect that TSMC will be in the market The market share on the 3nm process will continue to lead Samsung.